Martin Johnson

Sr. Director Of Engineering & Technology, Nypro

As the Senior Director of Engineering & Technology for Nypro Packaging, Martin is one of those rare leaders who can span both the technological and commercial aspects of a business. He is responsible for all frontend Engineering and Technology functions, as well as New Product Innovation activities within the company.  He draws from nearly 30 years of experience in packaging, plastics and consumer and healthcare products, from the ideation phase to delivering in-market results that build the brands and businesses of Nypro's customers.

Martin started with Nypro back in 1986, and is a founding member of Nypro's Packaging Division originally formed in 2003.  At that time, NyproMold began delivering brand-specific packaging solutions to customers, and Nypro has been delivering unique value via disruptive and differentiated smart packaging solutions throughout Martin's tenure.  Whether it's injection molded solutions, integration of technology and manufacturing excellence, or moving into the new world of intelligent packaging, Nypro Packaging delivers brand brilliance.  Nypro Packaging serves customers in the consumer products, food and beverage, and consumer health and industrial markets.

Martin attended the University of Illinois, and is certified in various mold and injection engineering technologies.  Throughout his career he has held design and engineering positions providing critical insight into how innovative packaging solutions get to market.  He has led projects and organizations around the globe, and is often asked to speak at industry conferences and events.  He enjoys spending his spare time with his wife and children in Maine, and welcomes connecting with other industry thought leaders.

Packaging: Past, Present and Future

A lively discussion of the history and potential future for packaging in the personal care and home care arenas from three viewpoints: those of the consumer, the brand owner and the manufacturer. Further, enabling technologies as well as potential challenges will be illuminated.